3M Sondhi Rapid-Set Indirect Bonding Adhesive Resin B
The Resin B component of a rapid-set indirect bonding adhesive system, formulated to cure quickly and reach strong early bond strength on brackets.
Sondhi Rapid-Set Indirect Bonding Adhesive Resin B is one half of a two-part chemical cure adhesive system used for indirect bonding, where brackets are pre-positioned onto a transfer tray in the lab and then bonded onto the teeth as a full arch in one clinical step. The adhesive is a lightly filled resin formulated to cure chemically in roughly half the time of many other indirect adhesives, which shortens the amount of time a patient needs to hold still with the tray seated in the mouth while the material sets.
Reaching a substantial portion of its final bond strength within the first five minutes also means the tray can often be removed sooner, reducing chair time on what is typically a longer appointment than single bracket bonding. Indirect bonding is used by practices that prefer to precisely position brackets in the laboratory using a model of the patient's teeth, transferring that accuracy directly into the mouth rather than placing each bracket freehand chairside.
Resin B is supplied to be used together with its matching Resin A component and the associated light-tight storage box as part of the same Sondhi Rapid-Set adhesive system.
